SPECIFICATIONS: 3D Hybrid Modular Mounter

Model Name: S20
Board size: (with buffer unused) Min. L 50 x W 30 mm to Max. L 1,830 x W 510 mm (Standard L 1,455) (with input and output buffers used) L 50 x W 30 mm to Max. L 540 x W 510 mm
Board thickness: 0.4 – 4.8 mm
Board flow direction: Left to right (Std)

Board transfer speed: Max. 900 mm/sec
Placement speed (12 heads + 2 theta) Opt. Cond.: 0.08 sec/CHIP (45,000CPH)
Placement accuracy A (μ+3 ): CHIP +/- 0.040 mm
Placement accuracy B (μ+3 ): IC +/- 0.025 mm

Placement angle: +/-180 degrees
Z axis control / Theta axis control: AC servo motor
Component height: Max. 30 mm *1 (Pre-placed components: max. 25 mm)
Applicable components: 0201 (mm) – 120 x 90 mm, BGA, CSP, connector, etc. (Standard 01005 -)
Component package: 8 – 56 mm tape (F1/F2 Feeders), 8 – 88 mm tape (F3 Electric Feeders), stick, tray
Drawback check: Vacuum check and vision check
Screen language: English, Chinese, Korean, Japanese
Board positioning: Board grip unit, front reference, auto conveyor width adjustment
Component types: Max 180 types (8 mm tape), 45 lanes x 4
Transfer height: 900 +/- 20 mm
Machine dimensions, weight: L 1750 x D 1750 x H 1420 mm, Approx. 1450 kg

*Specifications and appearance are subject to change without prior notice.

Learn More about the Yamaha S20

Contact us at Trans-Tec America to learn more about a full range of complementary Yamaha SMT products.


  • Enhancement to 3D MID
  • Max. feeder capacity 180 lanes
  • Large board handling capability
  • Wide range component handling capability
  • CFB/CTF full compatibility



Tel: 1-877-987-2678
Fax: 1-480-772-4333


Trans-Tec America LLC
7301 W. Boston Street
Chandler, AZ 85226


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E-mail: sales@trans-tec.com
Service Inquiries
E-mail: service@trans-tec.com

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